Sasov

 In this article the authors review physical limitations that determine the level of increasing the density of the layout of electronic equipment in the case of two-dimensional layout. There is a need for a new technology of assembling electronic equipment. The authors present a complex of 3D technologies for miniaturization of electronic devices which was developed in BMSTU and allows to reduce the weight and size parameters of the equipment and significantly improve its reliability a multiple number of times. The authors show the efficiency of creating equipment on a three-dimensional technology for a wide range of products of weapons and military equipment.