Kholevin

The authors consider application of a chemical-mechanical polishing method for planarization substrate surfaces in nano -and microsystems technology. The authors propose a method to calculate distribution of magnitude of wear on operating surface which undergoes chemical-mechanical polishing. The authors provide results of calculating distribution of magnitude of wear on the operating surface for some modes of processing wafers. The results can be used for design of chemical and mechanical polishing of substrate surface in nano- and microsystems technology.